PCB Circuit Board Design Software-FS Technology

On 2022年6月29日 By fspcbaIn 未分类Leave a comment

Abstract: Design a printed circuit board based on a schematic circuit to perform the functions required by the circuit manufacturer. Print design design refers to the circuit design, which must take into account the external design of the joint, the detailed design of the internal electrical components, and the detailed design of the metal joints and holes. What are the PCB circuit board design software? FS Technology will introduce you the mainstream pbc circuit board design software

The most popular circuit board design software in China

Protel, protel 99se, protel DXP, Altium are widely used in China. All of this software is developed and continuously developed by the company; the current version, Altium Design 15, is straightforward and can be used to easily create FS Tech PCB boards. But these softwares are not suitable for making hard PCBs.

Design better circuit board design software

Cadence SPB software Cadence SPB is Cadence software, the latest version is Cadence SPB 16.5; ORCAD design program is a global standard, and is also the most used circuit board design software by FS Technology; PCB design and simulation are more complete, and the use is much more complicated than Protel. The requirements and features are complex; but the rules are designed for the design, so the design is better, less work, and significantly stronger than the prototype.

Circuit board design software that few people use

Metor Boards and EEs, which only work on BOARDSTATION UNIX systems, are not designed for PCs, so they are rarely used; the current MentorEE version is Mentor EE 7.9, Cadence SPB is the same standard as PCB design software, and in some respects is better than Cadence Poor SPB. FS Technology has hardly used this type of board design software

The most popular circuit board design software in Europe and America

Eagle Layout is the most widely used PCB design software in Europe. Most of the PCB design software mentioned above are the most widely used, with Cadence SPB and Mentorai kings being the most ideal. If you are new to PCB design, FS Technology believes that Cadencespb is better, it can give manufacturers a good design experience and ensure good design quality.

Air conditioning PCB maintenance precautions-FS Technology

On 2022年6月16日 By fspcbaIn 未分类Leave a comment

With the arrival of summer, the frequency of use of air conditioners is getting higher and higher, followed by the maintenance of air conditioners. According to statistics, 70% of air conditioners are damaged due to pcb boards. This article will explain the maintenance precautions of FS Technology’s air conditioner circuit boards.

Printed circuit board current problems

There are many problems that need to be solved in repairing an air conditioner circuit board. First, let’s explain what happens when a string is expanded. The inductance of the printed circuit is kept to a minimum because the disturbance caused by its transient current in the printed circuit of the PCB circuit is mainly inductive component. The main method is to connect a horizontal line on one side of the printed board and a vertical line on the other side, and then use a cross hole to connect the metal chemical diameter

Printed circuit board material issues

Because there will be some cross height problems between the wires of the FS Technology PCB circuit board, in order to suppress this phenomenon, when designing and wiring, try to avoid long-distance same wires, and try to separate the Is wires from each other. The signal wire should not be connected to the ground wire. It crosses the power line far in the middle, and sets up ground traces between some signal lines that are very sensitive to interference, which can effectively suppress serial interference

The actual situation of pcb maintenance

In the actual maintenance of the air conditioner computer FS Technology board, first check the power circuit reset circuit, then replace the crystal oscillator, and then check the receiving remote control circuit. Finally check for CPU replacement. Because the CPU PIN change is the most difficult and expensive, more importantly, the CPU damage is very low, do not easily replace the CPU in the microcomputer control circuit

What electronics manufacturers have to know about PCBA prototyping

As an expert in the electronics manufacturing industry, you have to have a deep understanding of PCBA related knowledge, which includes manufacturing, assembly, and prototypes. In this article, we will discuss PCBA prototype manufacturing. Whether you are in automotive, consumer electronics, aerospace or any other industry, these Both will be good for you. Special PCBA…

by fspcba 2023年3月23日

PCB installation technology and steps

With the development of the electronics industry, more and more people pay attention to the “mother of electronic products” – PCBA. This FS PCBA will introduce the types of PCB assembly and the process of PCBA manufacturing for all electronics enthusiasts. PCB Assembly Technology Types Before starting the PCB assembly process, FS Technology will introduce you to…

by fspcba 2023年1月3日

Windows Remote Arduino

PCB components or supplies that need to be prepared in advance Arduino Uno Rev3 The Arduino Uno is a rigid PCB microcontroller board based on the ATmega328P (datasheet). It has 14 digital input/output pins (6 of which can be used as PWM outputs), 6 analog inputs, a 16 MHz ceramic resonator (CSTCE16M0V53-R0), a USB connection,…

by fspcba 2022年12月12日

Using Flexible Rigid PCBAs to Make Electronics More Reliable

Expensive and complex discrete interconnect cables can reduce design reliability, increase design cost and overall design size. In practice, discrete interconnect cables are a disadvantageous design. For electronic product sellers it goes against the trend of miniaturization of electronic products, and for PCBA manufacturers, it is an unreliable design. For project leaders, discrete interconnect cables…

by fspcba 2022年11月18日

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ESD Suppression Stop PCB Design-FS Technology

On 2022年6月14日 By fspcbaIn 未分类Leave a comment

PCB wiring is a key factor in ESD protection, FS Technology believes that a reasonable PCB design can reduce unnecessary costs caused by fault inspection and rework. In PCB design, it is more important to overcome the electromagnetic interference (EMI) electromagnetic field effect generated by the discharge current, because the transient voltage suppression stopper (TVS) diode is used to suppress the direct charge injection caused by the ESD discharge.

This article will provide optimized ESD protection for PCB design criteria.

1. Circuit loop.

When current enters circuit loops by induction, these loops are closed and have variable magnetic flux. The current range is proportional to the area of the ring. Larger loops contain more magnetic flux and therefore have stronger current induction in the circuit. Therefore, the loop area must be reduced. The most common loop consists of power and ground wires.

Multilayer PCB designs employ power and ground planes, where possible. Multilayer circuit boards not only minimize the circuit area between power and ground, but also reduce the high-frequency EMI electromagnetic fields generated by ESD pulses. If multilayer boards were not possible, FS Technology would have to connect the circuits for the power and ground lines into a grid. The grid connection can play the role of power and ground, and the printed lines of each layer should pass through holes and the connection interval in each direction should be within 6 cm. In addition, when wiring, the power and ground printed lines produced by FS Technology are as close as possible, which can also reduce the loop area.

Another way to reduce loop area and induced current is to reduce parallel paths between interconnects. When a signal cable longer than 30 cm must be used, a protective wire can be used. A better approach is to place the ground near the signal lines. The signal line should be within 13mm of the protection line or grounding line. Arrange long signal wires (>30cm) or power wires and their ground wires of each sensitive element in a crossover. Crossovers must be separated from top to bottom or left to right.

2. The length of the circuit connection.

Long signal lines can also be used as antennas for receiving ESD pulse energy. Trying to use short signal lines can reduce the efficiency of antennas receiving ESD electromagnetic fields. In order to reduce the printed line length of the interconnection, FS Technology will try to place the interconnection equipment in the adjacent position.

3. Inject the ground charge.

Direct discharge of ESD to the ground plane can damage sensitive circuits. Use one or more high frequency bypass capacitors between the power and ground of the consumables. Bypass capacitors reduce charge injection and maintain the voltage difference between the power and ground ports. The TVS shunts the induced current, maintaining the potential difference of the TVS clamping voltage. To reduce parasitic inductive effects, TVS and capacitors should be placed as close as possible to the protected IC.

Why do PCBA prototype board proofing

I believe that customers who need to purchase turnkey PCBA services know that circuit boards need to be inspected before mass production. We need to understand the product quality when we come out, and we can obtain quality assurance before PCBA prototype manufacturing. FS Technology believes that this is a necessary link, and the customer and the…

by fspcba 2022年9月20日

PCB Design-FS Technology

Summary: The design of the circuit board is based on the circuit diagram to perform the functions required by the circuit designer. The design of the printed circuit board is primarily a model design, which must take into account the shape of the external connectors, the correct shape of the internal electronic components, and the…

by fspcba 2022年7月1日2022年7月1日

PCB Circuit Board Design Software-FS Technology

by fspcba 2022年6月29日

Air conditioning PCB maintenance precautions-FS Technology

by fspcba 2022年6月16日

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Mark point design in PCB production-FS Technology

On 2022年6月9日 By fspcbaIn 未分类Leave a comment

1. The PCB must have a Mark point corresponding to the positioning of the entire board on the diagonal of the long side of the board.

Chips with an IC pin center distance of less than 0.65mm on FS Technology’s circuit boards should have a Mark point corresponding to the chip positioning on the diagonal of the long side of the IC; when there are patches on both sides of the pcb, both sides of the pcb should be Add Mark points based on this article.

2. The edge of the PCB should retain the 5mm process edge (the minimum spacing requirement for the machine to clamp the PCB).

Chips whose center-to-center distance between IC pins is less than 0.65mm should be greater than 13mm from the edge of the board (including the edge of the process); the four corners of the board should be chamfered with a φ5 arc. Judging from the current bending degree of PCB wings, the optimal splicing length is about 200mm (equipment processing size: maximum length is 330mm; maximum width is 250mm), try not to spell in the width direction to prevent bending during production.

3. MARK point functions and categories.

Mark points, also known as fiducials, provide a common measurable point for all steps in the assembly process to ensure that each assembly device can accurately locate the circuit pattern. Therefore, FS Technology believes that the Mark point is crucial for SMT production.

4. MARK point design specification recommended by our department.

1) Shape: It is recommended to mark the Mark point as a diameter: R=1.0mm solid circle;
2) Form a complete MARK point, including marked points (or feature points) and open areas.
3) Position: The Mark point is located at the relative position of the diagonal on the veneer or puzzle, and is separated as much as possible; it is best to distribute it at the longest diagonal position (such as the MARK point position diagram).
4) In order to ensure the installation accuracy requirements of FS Technology, SMT requirements: each PCB must have at least one pair of MARK points for the SMT machine to identify, and there must be a single-board MARK (when assembling).
Panel MARK or combined MARK only play a role of auxiliary positioning.
5) When assembling, the relative positions of the MARK points of each single board must be the same.
The position of the MARK point cannot be moved for any reason, resulting in asymmetrical position of the MARK point of each board;
6) All MARK points on the PCB are only valid: two MARKs appearing in pairs on the same diagonal are valid.
So MARK points must appear in pairs to be used (MARK point location map).

7) The distance between the MARK point (edge of the open area) and the edge of the PCB must be ≥5.0mm (minimum spacing requirements for the machine to clamp the PCB)

8) Requirements for open areas.

Around the mark point marking, there must be an open area with no other circuit features or markings.
The radius of the circle in the open area is R≥2R, where R is the radius of the MARK point.
When R reaches 3R, the machine recognition effect is better.

9) PBC Materials

Mark point markings can be bare copper, which is protected by a transparent anti-oxidant coating. If solder mask (solder mask) is used, the mark point or its open area should not be covered.

10) PBC Contrast.

A. The best identification performance is achieved when there is a high contrast between the mark point markings and the matrix material of the printed board.
B. The internal background must be the same for all mark points.
MARK classification:
1) Mark points are used for solder paste printing and component placement optical positioning.
According to the function of Mark points on the PCB, it can be divided into panel Mark points, single-board Mark points, local Mark points (also known as device-level Mark points),
2) There should be at least three Mark points on the edge of the FS technology paneling process and the veneer that does not need paneling, distributed in an L shape, and the diagonal Mark points are asymmetrical about the center.
3) If there are mounted components on both sides, then there must be mark points on each side.
4) There should be mark points on the board that needs to be assembled as much as possible. If there is no place to place the mark point, the mark point cannot be placed on the board.
5) For QFP with lead center distance ≤ 0.5mm and BGA equipment with center distance ≤ 0.8mm, the local Mark point should be set near the diagonal of the component center point for accurate positioning.
6) If several SOP devices are relatively close (≤100 mm) to form an array, they can be regarded as a whole, and two local Mark points are designed at their diagonal positions.

PCB Design Program – FS Technology

The reason PCBs are called single-sided is because the simplest PCBs have parts on one side and wires on the other. This is because the wires only appear on one side. Multilayer boards with multiple layers of conductors require proper circuit connections between the two layers. The bridge between the chains is called a viaduct.…

2022年6月15日

ESD Suppression Stop PCB Design-FS Technology

2022年6月14日

Optical Fiducial PCB Design-FS Technology

On a PCB with a patch, in order to locate the entire PCB, it is usually necessary to place the optical positioning points on the four corners of the PCB, generally three.Common reference points mainly include three types of board reference points, unit reference points and local reference points. 1. Reference point structure (1) Panel…

2022年6月8日

Optical Fiducial PCB Design-FS Technology

On 2022年6月8日 By fspcbaIn 未分类Leave a comment

On a PCB with a patch, in order to locate the entire PCB, it is usually necessary to place the optical positioning points on the four corners of the PCB, generally three.
Common reference points mainly include three types of board reference points, unit reference points and local reference points.

1. Reference point structure

(1) Panel datum point and unit datum point.

Shape/Size: 40mil diameter solid circle.
FS Technology Solder Mask Window: A circle concentric with the reference point, the size is twice the diameter of the reference point.
A 2mm diameter edge requires a round or octagonal copper wire as a guard ring.
The internal background of the optical positioning reference symbols on the same board should be the same, that is, whether there is copper foil under the three reference symbols should be consistent.

(2) Local datum point.

Parts such as QFP and pitch ≤0.4mm BGA, CSP, FC need to place local fiducials.
Size/Shape: Solid circle, 40mil diameter.
Solder mask opening: The size is processed according to the ordinary pad, and the outer ring copper ring cannot.

2. Place the datum point:

General principles:

The veneer for processing SMT equipment must be placed with fiducial points.
The number of single-sided reference points is greater than or equal to 3.
For single-sided layout, simply place the datum point on the component face.
..When A5I5^0L-z1m+PPCB is double-sided layout, the fiducials are placed on both sides.
For the datum points placed on both sides, except for mirror splicing, the positions of the datum points on both sides are basically the same.

(1) The reference point for FS Technology to place the puzzle.

Panel datum points and cell datum points need to be placed.
There are three panel fiducials and unit fiducials.
The edges of the board are distributed in an L shape, and keep them as far away as possible.
Figure A below shows the location requirements for the panel datum points.
When using a mirror-symmetrical panel, the reference point on the auxiliary side must meet the requirements of overlapping after flipping, as shown in Figure B below.

(2) The datum point for placing the cell board.

The number of reference points is three, distributed in an L shape on the edge of the board, and the distance between each reference point should be as far as possible.
The edge of the reference point must be greater than 5mm.
If all four edges are not guaranteed to be satisfied, the transmission edge should at least satisfy the requirements.

Mark point design in PCB production-FS Technology

1. The PCB must have a Mark point corresponding to the positioning of the entire board on the diagonal of the long side of the board. Chips with an IC pin center distance of less than 0.65mm on FS Technology’s circuit boards should have a Mark point corresponding to the chip positioning on the diagonal…

2022年6月9日

Mark point design in PCB production-FS Technology

2022年6月2日

Designed PCB Stackup – FS Technology

2022年5月31日

Mark point design in PCB production-FS Technology

On 2022年6月2日 By fspcbaIn 未分类1 Comment

1. The PCB must have a Mark point corresponding to the positioning of the entire board on the diagonal of the long side of the board.

2. The edge of the PCB should retain the 5mm process edge (the minimum spacing requirement for the machine to clamp the PCB).

Chips whose center-to-center distance between IC pins is less than 0.65mm should be greater than 13mm from the edge of the board (including the edge of the process); the four corners of the board should be chamfered with a φ5 arc. Judging from the current bending degree of PCB wings, the optimal splicing length is about 200mm (equipment processing size: maximum length is 330mm; maximum width is 250mm), try not to spell in the width direction to prevent bending during production.

3. MARK point functions and categories.

4. MARK point design specification recommended by our department.

1) Shape: It is recommended to mark the Mark point as a diameter: R=1.0mm solid circle;
2) Form a complete MARK point, including marked points (or feature points) and open areas.
3) Position: The Mark point is located at the relative position of the diagonal on the veneer or puzzle, and is separated as much as possible; it is best to distribute it at the longest diagonal position (such as the MARK point position diagram).
4) In order to ensure the installation accuracy requirements of FS Technology, SMT requirements: each PCB must have at least one pair of MARK points for the SMT machine to identify, and there must be a single-board MARK (when assembling).
Panel MARK or combined MARK only play a role of auxiliary positioning.
5) When assembling, the relative positions of the MARK points of each single board must be the same.
The position of the MARK point cannot be moved for any reason, resulting in asymmetrical position of the MARK point of each board;
6) All MARK points on the PCB are only valid: two MARKs appearing in pairs on the same diagonal are valid.
So MARK points must appear in pairs to be used (MARK point location map).

7) The distance between the MARK point (edge of the open area) and the edge of the PCB must be ≥5.0mm (minimum spacing requirements for the machine to clamp the PCB)

8) Requirements for open areas.

9) PBC Materials

Mark point markings can be bare copper, which is protected by a transparent anti-oxidant coating. If solder mask (solder mask) is used, the mark point or its open area should not be covered.

10) PBC Contrast.

A. The best identification performance is achieved when there is a high contrast between the mark point markings and the matrix material of the printed board.
B. The internal background must be the same for all mark points.
MARK classification:
1) Mark points are used for solder paste printing and component placement optical positioning.
According to the function of Mark points on the PCB, it can be divided into panel Mark points, single-board Mark points, local Mark points (also known as device-level Mark points),
2) There should be at least three Mark points on the edge of the FS technology paneling process and the veneer that does not need paneling, distributed in an L shape, and the diagonal Mark points are asymmetrical about the center.
3) If there are mounted components on both sides, then there must be mark points on each side.
4) There should be mark points on the board that needs to be assembled as much as possible. If there is no place to place the mark point, the mark point cannot be placed on the board.
5) For QFP with lead center distance ≤ 0.5mm and BGA equipment with center distance ≤ 0.8mm, the local Mark point should be set near the diagonal of the component center point for accurate positioning.
6) If several SOP devices are relatively close (≤100 mm) to form an array, they can be regarded as a whole, and two local Mark points are designed at their diagonal positions.

Designed PCB Stackup – FS Technology

On 2022年5月31日 By fspcbaIn 未分类1 Comment

Before designing a multi-layer PCB circuit board, the designers of FS Technology must first determine the circuit board structure used, that is, decide to use a 4-layer, 6-layer or more circuit board, and then according to the size and electromagnetic compatibility of the circuit board. (EMC) requirements to determine the size of the circuit board.
After determining the number of layers, determine where to place the internal electrical layers and how to distribute the different signals on these layers. This is the choice of the multilayer PCB stack-up structure.
Laminated structure is not only an important factor affecting the EMC performance of PCB boards, but also an important means to suppress electromagnetic interference.
This section will introduce the related content of the multi-layer PCB board stack-up structure of FS Technology.
After each PCB engineer counts the number of layers, each PCB engineer cannot avoid the relative arrangement between them;

1. More factors need to be considered to determine the laminate structure of the multi-layer PCB board.
In terms of wiring, the more layers, the better for wiring, but the cost and difficulty of manufacturing the board will also increase.
For FS Technology PCB manufacturers, the symmetry of the laminated structure is the focus of attention in the PCB manufacturing process, so the selection of the number of layers needs to consider the needs of various aspects to achieve the best balance. For experienced designers, after completing the pre-layout of components, the analysis will focus on the wiring bottlenecks of FS Technology’s PCBs. Combine other EDA tools to analyze the wiring density of the circuit board; then integrate the signal lines with special wiring requirements, such as differential lines, the number and type of sensitive signal lines, to determine the number of signal layers; then determine the internal electrical layers according to the type of power supply quantity. isolation and anti-interference requirements. In this way, the board count of the entire circuit board is basically determined.

2. The ground below the component surface (the second layer) provides the equipment shielding layer and reference plane for the top layer wiring;
The sensitive signal layer should be adjacent to the inner power layer (internal power layer/ground layer), and the large copper film of the inner power layer is used to shield the signal layer. The high-speed signal transmission layer in the circuit should be a signal intermediate layer, sandwiched between two internal power supply layers. In this way, the copper films of the two inner electrical layers can provide electromagnetic shielding for high-speed signal transmission, and FS Technology can effectively limit the radiation of high-speed signals between the two inner electrical layers at the same time, without causing external interference.

3. All signal layers as close as possible to the ground plane;

4. Try to avoid two signal layers directly adjacent to each other; crosstalk is easily introduced between adjacent signal layers, resulting in circuit failure.
Effectively avoid crosstalk by adding a ground plane between the two signal layers.

5. The main power supply should be as adjacent as possible;

5. The symmetry of the laminate structure.

6. For the layer layout of the motherboard, it is difficult to control the parallel long-distance wiring of the existing motherboard.
For the board-level operating frequency above 50MHZ (refer to the operating frequency below 50MHZ and relax it appropriately), FS Technology recommends the arrangement principles:
Component surface. The welding surface is a complete ground plane (shielding);
No adjacent parallel wiring layers;
All signal layers as close as possible to the ground plane;
Critical signals are adjacent to the formation and do not cross the segmented area.

Note: When setting the layers of a specific PCB, the above principles should be flexibly grasped. On the basis of understanding the above principles, according to the needs of the actual single board, such as: whether a key wiring layer, power supply, and ground plane division are required, etc. , to determine the arrangement of the layers, do not rigor or hold on to it.

7. Multiple grounded inner electrical layers can effectively reduce the grounding impedance. For example, the A signal layer and the B signal layer use separate ground planes, which can effectively reduce common mode interference.

FS Technology – the best circuit board manufacturer in the world

What is turnkey printed circuit board assembly

The one-stop service for PCBA circuit board assembly is the good news for customers, that is, customers package their own requirements for circuit board assembly, hand over all the materials to FS Technology, and FS Technology directly assembles the finished product and sends it to the customer, including “assembly and detection”. Customers only need to accept the…

by fspcba 2022年5月30日

What is PCBA

PCBA is the abbreviation of Printed Circuit Board +Assembly in English, which means that the blank PCB board goes through SMT loading, and then goes through the entire process of DIP plug-in, referred to as PCBA. This is a commonly used writing method in China, and the standard writing method in Europe and America is…

by fspcba 2022年5月6日2022年5月30日

The use of PCBA

Regarding what PCBA does, we recommend everyone to learn about it by understanding the role of PCBA processing equipment. PCBA processing is an electronic processing industry with a relatively high degree of integration of machinery and equipment. The use of more and more mature processing machinery and equipment and the improvement of manufacturing processes have…

by fspcba 2022年5月6日2022年5月30日

What is turnkey printed circuit board assembly

On 2022年5月30日 By fspcbaIn 未分类Leave a comment

The one-stop service for PCBA circuit board assembly is the good news for customers, that is, customers package their own requirements for circuit board assembly, hand over all the materials to FS Technology, and FS Technology directly assembles the finished product and sends it to the customer, including “assembly and detection”. Customers only need to accept the goods after receiving the goods.

What exactly does FS Technology’s one-stop service include?

FS Technology’s one-stop PCBA assembly service includes PCB design, PCB proofing, PCBA processing (including SMT, DIP), connector crimping, BGA soldering, rework, reballing, PCBA testing,turnkey printed circuit board assembly, packaging and delivery.

FS Technology is customer-centric and thinks about PCBA services from the perspective of customers. Customers only need to put forward requirements, solutions and final product sales. It is the principle of FS Technology to let customers devote themselves to the research and development and sales of new products, and save a lot of time, energy and production costs for customers.

Different from traditional circuit board manufacturing

According to the traditional method, due to the insufficient ability of electronic product manufacturers, they often find professional PCB manufacturers to make circuit boards, and DIP or SMT manufacturers to make patches, and finally assemble, test and sell the products themselves after acceptance. This traditional approach will cost customers more money and time.

FS Technology’s circuit board assembly service provides customers with a total PCBA manufacturing solution service. We can shorten production cycles while reducing overhead. Through PCB circuit board manufacturing, SMT processing, electronic component procurement and other processes, the comprehensive cost of personnel, warehousing, logistics, etc. is truly reduced, and the risks and cycles of the supply chain are greatly shortened and reduced.

What is PCBA

On 2022年5月6日2022年5月30日 By fspcbaIn 未分类Leave a comment

Extended information:

application

3C products such as computers and related products, communication products and consumer electronics are the main application areas of PCB. According to data published by the Consumer Electronics Association (CEA), global consumer electronics sales will reach $964 billion in 2011, an increase of 10% year-on-year. The 2011 figure was pretty close to $1 trillion. CEA said that the biggest demand comes from smart phones and notebook computers, and other products that sell very well include digital cameras, LCD TVs and other products.

computer

Gartner analysts point out that notebooks have been the growth engine of the PC market over the past five years, with an average annual growth rate of nearly 40%. Based on expectations of weakening notebook computer demand, Gartner predicts that worldwide PC shipments will reach 387.8 million units in 2011 and 440.6 million units in 2012, an increase of 13.6% over 2011. In 2011, sales of removable computers, including tablets, will reach $220 billion, while desktop sales will reach $96 billion, bringing total PC sales to $316 billion, the CEA said.

The iPad 2 was officially released on March 3, 2011, and will use 4th-level Any Layer HDI in the PCB manufacturing process. The Any Layer HDI adopted by Apple’s iPhone 4 and iPad 2 will trigger a boom in the industry, and it is expected that Any Layer HDI will be applied in more and more high-end mobile phones and tablet computers in the future.

smart phone

According to the latest market research report released by Markets and Markets, the global mobile phone market size will increase to 341.4 billion US dollars in 2015, of which smartphone sales revenue will reach 258.9 billion US dollars, accounting for 76% of the total mobile phone market revenue; while Apple will Leading the global mobile phone market with a 26% market share.

iPhone 4 PCB adopts Any Layer HDI board, any layer of high-density connection board. In order to fit all the chips on the front and back sides of the iPhone 4 in a very small PCB area, using the Any Layer HDI board can avoid the waste of space caused by machine or drilling, and achieve the purpose that any layer can be turned on.

touch panel

With the popularity of iPhone and iPad all over the world and the popularity of multi-touch applications, it is predicted that the trend of touch will become the next growth driver of FPC. DisplaySearch expects 260 million touchscreen shipments for tablet PCs in 2016, up 333 percent from 2011.

e-book

According to DIGITIMES Research, global e-book shipments are expected to reach 28 million units in 2013, with a compound annual growth rate of 386% from 2008 to 2013. Analysis pointed out that by 2013, the global e-book market will reach 3 billion US dollars. The design trend of PCB boards for e-books: First, the number of layers is required to be increased; the second is to use blind buried via technology; the third is to use PCB substrates suitable for high-frequency signals.

digital camera

Digital camera production will start to stagnate in 2014 as the market becomes saturated, iSuppli said. Shipments are expected to drop by 0.6% to 135.4 million units in 2014, as low-end digital cameras will encounter strong competition from camera phones. But growth is still possible in certain areas of the industry, such as hybrid high-definition (HD) cameras, future 3D cameras, and more premium cameras such as digital single-lens reflex (DSLR). Other growth areas for digital cameras include integrating features such as GPS and Wi-Fi, increasing their appeal and potential for everyday use. Promoting the further improvement of the soft board market, in fact, the demand for soft boards is very strong for any light, thin and short electronic products.

LCD TV

Market research firm DisplaySearch expects global LCD TV shipments to reach 215 million units in 2011, an increase of 13 percent year-on-year. In 2011, LED backlight modules will gradually become mainstream due to the gradual replacement of LCD TV backlights by manufacturers. The technical trend brought to LED heat dissipation substrates: first, high heat dissipation, precision-sized heat dissipation substrates; second, strict circuit alignment Accuracy, high-quality metal circuit adhesion; 3. Use yellow light lithography to make thin-film ceramic heat dissipation substrate to improve LED high power.

LED lighting

Analysts from DIGITIMES Research pointed out that in response to the ban on production and sales of incandescent lamps in 2012, the shipments of LED bulbs will grow significantly in 2011, and the output value is estimated to be as high as about 8 billion US dollars. Driven by factors such as the implementation of subsidy policies for green products such as LED lighting, and the high willingness of stores, shops and factories to replace them with LED lighting, the global LED lighting market penetration rate has a great chance to exceed 10% in terms of output value. LED lighting, which took off in 2011, will definitely drive a large demand for aluminum substrates.

The use of PCBA

On 2022年5月6日2022年5月30日 By fspcbaIn 未分类Leave a comment

Printing machine The printing machine is located at the front end of the PCBA processing production line, and its main purpose is to print solder paste or patch glue on the PCB circuit board. The workflow is that after the mesh of the stencil of the printing machine is aligned with the PCB pad, through the movement of the scraper, the solder paste or patch glue placed on the stencil is leaked to the PCB pad or the corresponding position for PCBA processing. Prepare for component placement in the subsequent process.
Dispensing machine The main purpose of the dispensing machine is to apply solder paste or patch glue. The workflow is to apply a prescribed dose of glue or solder paste to the desired location of the PCBA device through the pressure of the vacuum pump. The advantage of the glue dispenser is that in the production process, there is no need to replace the production fixture, which greatly shortens the production cycle and is suitable for small batch production of multiple products.
Mounter Mounter is the core mechanical equipment in PCBA processing, also known as placement machine. The main purpose is to accurately remove the known material from the specified position through the pre-set conditions, and correctly place it on the specified position. The placement capacity and production capacity of PCBA processing mainly depend on functional parameters such as the speed and accuracy of the placement machine. It is also a high-tech, complex and expensive equipment in the PCBA process. Automatic placement machine is a high-speed, high-precision, highly automated and highly intelligent equipment integrating fine machinery, electric, pneumatic, optical, computer, sensing technology, etc.
The main purpose of the reflow soldering machine is to fuse the solder pre-distributed on the PCB circuit board by the printer by providing a stable and controllable heating environment, so that the surface mount components and the PCB pads can be reliably combined with solder paste. .
Testing equipment The main function of testing equipment is to test the assembly quality and street quality of the mounted PCBA. The equipment used mainly includes magnifying glass, microscope, automatic optical detector, online tester, X-ray detection system, function tester, etc. According to the needs of inspection, its installation position is the position behind the corresponding production line.
Rework equipment The main function of the rework equipment is to rework and repair the PCBA finished products that have been detected faults. The tools used are soldering irons, BGA rework stations, etc.
Cleaning equipment The function of cleaning equipment is to remove substances that affect electrical properties or welding residues that are harmful to the human body, such as flux, on the processed PCBA finished product. If no-clean solder is used, no cleaning is required, and the cleaning equipment is an ultrasonic cleaner and a special cleaning solution. PCBA and PCB look very close, and they are often confused by laymen. The difference between them is as follows. The second board that has already processed and installed components is called PCBA, commonly known as circuit board. Our common motherboards and sound cards are commonly known as PCBAs in the industry. However, PCBA generally refers to the name used as an accessory in the production process. The core part of all electronic products in its function is composed of PCBA; the realization of all functions is inseparable from PCBA. Taking a desktop computer as an example, the units inside the chassis do not contain PCBA except for the heat dissipation part, and all the remaining functional units have PCBA. There are PCBAs in the hard disk and power supply. The display other than the host has a display driver board (PCBA) and an LCD screen, and there is also a PCBA in the LCD screen. There is also a small PCBA inside the mouse, keyboard, and even the Bluetooth receiver of the wireless keyboard and mouse. Therefore, PCBA is the basic unit of all functions in the electronics industry.

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